Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K

Product no.: HTK-002-U1-GP

Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

Features
Type:	Thermal paste
Thermal conductivity:	4.5 W/m·K
Product colour:	White
Thermal resistance:	0.8 °C/W
Specific gravity:	2.37 g/cm³
Packaging data
Quantity per pack:	1 pc(s)
Package width:	102 mm
Package depth:	171 mm
Package height:	40 mm

Price:

27,22 €

20 % VAT incl. excl. Shipping costs