Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g
Product no.: XZ019
Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g.
| Features | |
| Thermal conductivity: | 5.15 W/m·K |
| Product colour: | Black, Red, White |
| Viscosity note: | 73 CPS |
| Thermal resistance: | 0.201 °C/W |
| Operating temperature (T-T): | -30 - 280 °C |
| Certification: | CE |
| Technical details | |
| Sustainability certificates: | RoHS |
| Weight & dimensions | |
| Weight: | 3 g |
| Packaging data | |
| Quantity per pack: | 1 pc(s) |
| Package width: | 120 mm |
| Package depth: | 20 mm |
| Package height: | 10 mm |
Price:
23,99 €
19 % VAT incl. excl. Shipping costs
